Microwave PLASMA Improves Reliability of Die Bonding Process

Die Bonding is to assemble the chip to the substrate or frame. Commonly used methods include eutectic welding, silver glue bonding, lead-tin alloy welding, etc.
Last week we learned how microwave PLASMA can improve the reliability of eutectic soldering.
This week, let's discuss the silver glue bonding process of chips together and see how microwave PLASMA can improve the reliability of chip bonding.

NO.1 The main function of silver adhesive bonding

Silver glue is an adhesive with certain electrical conductivity after curing or drying. It is necessary to choose silver glue for interconnection of low-power chips and interconnection of non-solderable surfaces.

The main function of silver glue

The main function of silver adhesive bonding is to provide good electrical and thermal conductivity and curing effect between the chip and the substrate or frame. Therefore, between the chip and the substrate or frame, not only a good conductive path needs to be formed, but also a certain bonding strength is required.

NO.2 Factors Affecting Die Bonding

Die attach reliability is a key factor in the quality of electronic packaging, which directly affects the quality and lifespan of the entire IC circuit.
Whether there is organic contamination on the surface of the substrate or frame, oxide film, wettability of silicon crystals on the back of the chip, etc., will affect the bonding effect.

NO.3 How to improve the reliability of die bonding

Ways to improve die bonding reliability:

1. Use microwave PLASMA to remove organic contamination on the surface of the substrate or frame;
2. Use microwave PLASMA to activate the back of the chip to improve the surface activity of silicon crystals and improve its wettability;

Microwave PLASMA Effect Verification

In the experiment, a microwave PLASMA cleaning machine was used to process the silicon wafer, and the contact angle measured after processing was below 10°.

In the experiment, a microwave PLASMA cleaning machine was used to process the lead frame, and the contact angle measured after treatment was about 12°.

Experimental proof:

Using a microwave PLASMA plasma cleaner to treat the surface of the chip and the frame can effectively clean and improve the wettability of the surface, thereby improving the effect of chip bonding.

NO.4 Why choose microwave PLASMA

In order to ensure the device performance after Die Bonding, it is necessary to remove organic pollutants and oxide films on the surface without destroying the surface characteristics and electrical characteristics of the chip and other materials used. RF plasma technology has been unable to meet the current technical needs due to high processing temperature, insufficient uniformity, and the possibility of chip damage caused by RF current.
Shengding Precision independently developed a microwave plasma generator with high efficiency and uniformity, which can help you remove organic contamination on the surface of precision devices without damage, and activate the surface of the device, thereby significantly improving manufacturability, reliability and yield.

Advantages of Shengding Microwave PLASMA

Shengding microwave PLASMA technical advantages

Shengding Microwave PLASMA market advantage