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Home > News > Company Information > Another honor | Shengding Precision won the "Mini & Micro LED Equipment Annual Product Award"

Another honor | Shengding Precision won the "Mini & Micro LED Equipment Annual Product Award"

2021-12-03

On December 1-2, 2021, the 2021 Expert Talk Annual Conference Mini&Micro Led Display Advanced Application Conference and the Expert Aurora Award Award Ceremony hosted by Expert Information Technology was held at the Crowne Plaza Shenzhen Bao'an District International Convention and Exhibition Center.


Dongguan Sindin Precision Instrument Co., Ltd., as a leading and excellent representative of supply chain enterprises in the industry, was invited to attend, and won the 2021 Expert Aurora Award "Mini & Micro LED Equipment Annual Product Award" with "SDK-500S Online Wide Linear Plasma Cleaner".



At the meeting, the "2021 Mini LED Backlight Development White Paper" was released! The "White Paper" was jointly participated and compiled by Xingjiashuo Industry Research Center and more than 20 units. SINDIN is one of the participating units.



Competition products


SDK-500S Online Wide Format Plasma Cleaner


Based on the product features of the existing Mini Led and the characteristics of the current automated production line, Sindin Precision has developed the SDK-500S online wide-width linear plasma cleaning machine that cooperates with the existing assembly line, effectively meeting the needs of the Mini Led production line for large-scale plasma cleaning. . Left in and right out, suitable for automated assembly line operations, and can realize functions such as incoming and outgoing material induction, plasma self-starting, and automatic feedback of the lower station. Realize the automation of the production line, which not only increases the production capacity, but also can carry out material transmission and information management and traceability of products through MES, and at the same time reduce the production line personnel.


Provide PLASMA for Mini/Micro LEDs


During the Mini LED packaging process, if there are particulate pollutants, oxides and epoxy resin pollutants on the chip and the substrate, it will directly affect the yield of Mini LED products. Before dispensing and wire bonding in the encapsulation process Plasma cleaning prior to encapsulation and curing can effectively remove these contaminants. encapsulation is the link between the industry and the market. Only after encapsulation can it become a terminal product and put into practical application.


In the LED industry, the plasma cleaning machine has become a rigid need in the packaging process!

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