At present, the binding technology of the display industry is mainly divided into COB, COF, TCP, COG and other processes. The biggest problem in the binding process is the presence of pollutants on the binding surface, which leads to the reduction of binding quality and the potting after binding. The reduction in strength directly affects the quality and service life of the FPD.

In the COG process of mounting bare chip ICs (bare chip ICs) on glass substrates (LCDs), when the chips are bonded and hardened at high temperatures, the components of the substrate coating are deposited on the surface of the bonding filler. Spills of silver paste and other joining agents contaminate the bonding filler. If these contaminants are removed by plasma cleaning before the thermocompression bonding process, the quality of thermocompression bonding can be greatly improved. In addition, due to improved wettability between the substrate of the bare chip and the IC surface, the bond tightness of the LCD-COG module is also improved, and the problem of line corrosion is also reduced.

Matters needing attention when using plasma cleaners

When the plasma cleaner treats the surface of the material, the frequency, process gas selection, gas flow, power and treatment time directly affect the quality of the material surface treatment. Reasonable selection of these parameters will effectively improve the treatment effect. At the same time, factors such as temperature, gas distribution, and electrode settings during processing will also affect the processing quality to varying degrees. Therefore, different process parameters should be optimized for different materials.