Why can plasma cleaners be used in the field of semiconductor packaging?
Plasma technology is an important part of dry cleaning applications. With the development of microelectronics technology, the advantages of plasma cleaning are becoming more and more obvious. During the production process of semiconductor devices, there will be contamination impurities such as various particles, metal ions, organic substances and residual abrasive particles on the surface of the wafer chip. In order to ensure the IC integration and device performance, it is necessary to clean and remove these harmful contaminants on the surface of the chip without destroying the surface characteristics and electrical characteristics of the chip and other materials used. Otherwise, they will cause fatal effects and defects on chip performance, reduce product qualification rate, and restrict the further development of devices. At present, almost every process in device production has a cleaning step, the purpose of which is to remove contamination and impurities on the chip surface. The widely used physical and chemical cleaning methods can be roughly divided into wet cleaning and dry cleaning. Dry cleaning has developed rapidly, among which plasma cleaning has obvious advantages, and has been popularized and applied in the field of semiconductor device and optoelectronic component packaging.
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Application of plasma cleaning in semiconductor packaging production
Plasma cleaning has broad application prospects in the field of microelectronic packaging. The successful application of plasma cleaning technology depends on the optimization of process parameters, including process pressure, plasma excitation frequency and power, time and process gas type, reaction chamber and electrode. Configuration and placement of workpieces to be cleaned, etc. In the back-end production process of semiconductors, various contaminations are formed on the surface of devices and materials due to fingerprints, flux, solder, scratches, contamination, fine dust, resin residue, self-heating oxidation, organic matter, etc., and these contamination will be obvious. These molecular-level contaminations formed in the production process can be easily removed by using plasma cleaning technology, thereby significantly improving the manufacturability, reliability and yield of packaging.
